Heat Pipe Plate for Mobile Phone Cooler Dissip Uniform Plate Increases Heat Dissipation Area Aluminum Sheet with Magnet

Strongly recommend B pro or E pro, which have built-in heat pipes for better performance.

It needs to be used in conjunction with cooler to increase the cooling area. The package does not include the cooler or the phone.

Please use a ruler to measure your phone to choose the most suitable model. Our images have detailed dimensions.

Material: aluminum alloy+heat pipe+neodymium iron boron magnet+thermal conductive double-sided tape (B pro and E pro have built-in heat pipes, while B and E do not include heat pipes)

Thickness: approximately 1.4mm (not suitable for installation inside phone cases)

If your phone has a magnetic back, you can use it directly without peeling off the film. If your phone does not have a magnetic back, you need to peel off the film and stick it to the back of the phone.

After attaching it, the wireless charger cannot be used.

Packaging:

1 pc plate (does not include cooler)